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  rev.4.00 may.19, 2005 page 1 of 6 HAT2203C silicon n channel mos fet power switching rej03g0447-0400 rev.4.00 may 19.2005 features ? low on-resistance r ds(on) = 69 m ? typ.(at v gs = 4.5 v) ? low drive current ? high density mounting ? 2.5 v gate drive device outline renesas package code: pwsf0006ja-a (package name: cmfpak - 6) 1. source 2. drain 3. drain 4. drain 5. drain 6. gate 1 2 3 6 5 4 g d s 6 1 5 d 2 d 3 d 4 index band absolute maximum ratings (ta = 25c) item symbol ratings unit drain to source voltage v dss 20 v gate to source voltage v gss 12 v drain current i d 2 a drain peak current i d (pulse) note1 8 a body - drain diode reverse drain current i dr 2 a channel dissipation pch note2 830 mw channel temperature tch 150 c storage temperature tstg ?55 to +150 c notes: 1. pw 10 s, duty cycle 1% 2. when using the glass epoxy board (fr4 40 x 40 x 1.6mm)
HAT2203C rev.4.00 may.19, 2005 page 2 of 6 electrical characteristics (ta = 25c) item symbol min typ max unit test conditions drain to source breakdown voltage v (br)dss 20 ? ? v i d = 10 ma, v gs = 0 gate to source breakdown voltage v (br)gss 12 i g = 10 a, v ds = 0 gate to source leak current i gss ? ? 10 a v gs = 10 v, v ds = 0 drain to source leak current i dss ? ? 1 a v ds = 20 v, v gs = 0 gate to source cutoff voltage v gs(off) 0.4 ? 1.4 v v ds = 10 v, i d = 1 ma r ds(on) ? 69 90 m ? i d = 1 a, v gs = 4.5 v note3 drain to source on state resistance r ds(on) ? 107 150 m ? i d = 1 a, v gs = 2.5 v note3 forward transfer admittance |yfs| 3 4.5 ? s i d = 1 a, v ds = 10 v note3 input capacitance ciss ? 165 ? pf v ds = 10 v output capacitance coss ? 50 ? pf v gs = 0 reverse transfer capacitance crss ? 20 ? pf f = 1 mhz turn - on delay time t d(on) ? 6 ? ns rise time t r ? 5 ? ns turn - off delay time t d(off) ? 20 ? ns fall time t f ? 4 ? ns i d = 1 a v gs = 10 v r l = 10 ? rg = 4.7 ? total gate charge qg ? 1.8 ? nc gate to source charge qgs ? 0.4 ? nc gate to drain charge qgd ? 0.4 ? nc v dd = 10 v v gs = 4.5 v i d = 2 a body - drain diode forward voltage v df ? 0.8 1.1 v i f = 2 a, v gs = 0 note3 notes: 3. pulse test
HAT2203C rev.4.00 may.19, 2005 page 3 of 6 main characteristics 1600 1200 800 400 0 50 100 150 200 -30 -10 -3 -1 -0.3 -0.1 -0.1 -0.3 -0.01 -1 -3 -10 -30 -100 10 8 6 4 2 0 2 46810 10 8 6 4 2 0 12345 -0.03 -0.01 -100 ta = 25 c,1 shot pulse when using the fr4 board. 1.5 v 2 v tc = 75 c 25 c ? 25 c channel dissipation pch (mw) case temperature ta ( c) power vs. temperature derating drain to source voltage v ds (v) drain current i d (a) maximum safe operation area drain to source voltage v ds (v) drain current i d (a) typical output characteristics pulse test gate to source voltage v gs (v) drain current i d (a) typical transfer characteristics v ds = 10 v pulse test 1 ms pw = 10 ms dc ope ration (ta = 25c) 10 s 10 v 300 200 100 0 24 6 8 10 0.1 10 1 100 100 1000 10 gate to source voltage v gs (v) drain to source saturation voltage vs. gate to source voltage drain current i d (a) static drain to source on state resistance vs. drain current 400 i d = 2 a 1 a 0.5 a pulse test v gs = 2.5v pulse test operation in this area is limited by r ds(on) 2.5 v test conditions: when using the glass epoxy board (fr4 40 x 40 x 1.6 mm) 100 s 3 v 4.5 v v gs = 1 v ta = 25 c 4.5v when using the glass epoxy board (fr4 40 x 40 x 1.6 mm) drain to source saturation voltage v ds(on) (mv) drain to source on state resistance r ds(on) ( ? )
HAT2203C rev.4.00 may.19, 2005 page 4 of 6 200 160 120 80 40 ? 25 0 25 50 75 100 125 150 0 0.03 0.01 0.3 3 10 10 3 1 0.3 0.1 0.03 0.01 0.1 1 case temperature tc ( c) e c n a t s i s e r e t a t s n o e c r u o s o t n i a r d c i t a t s r ) n o ( s d m ( ? ) static drain to source on state resistance vs. temperature drain current i d (a) forward transfer admittance vs. drain current ) s ( | s f y | e c n a t t i m d a r e f s n a r t d r a w r o f 25 c tc = ? 25 c 75 c v ds = 10 v pulse test v gs = 2.5 v pulse test 0.5 a i d = 2 a 1 a 0 8 16 24 3000 1000 10000 100 300 40 0 8 30 6 20 4 10 2 0.8 1.6 2.4 3.2 4.0 0 1000 100 1 10 0.1 0.3 1 3 10 30 100 30 10 3 1 v gs = 0 f = 1 mhz ciss coss crss i d = 2 a v dd v gs ) f p ( c e c n a t i c a p a c drain to source voltage v ds (v) typical capacitance vs. drain to source voltage gate charge qg (nc) v e g a t l o v e c r u o s o t n i a r d s d ) v ( v e g a t l o v e c r u o s o t e t a g s g ) v ( dynamic input characteristics drain current i d (a) ) s n ( t e m i t g n i h c t i w s switching characteristics v dd = 20 v 10 v 5 v t d(on) t d(off) t f t r v dd = 5 v 10 v 20 v 0.5 a 1 a 2 a 41220 0 0.4 0.8 1.2 1.6 2.0 10 4 v gs = 0 , -5 v source to drain voltage v sd (v) reverse drain current vs. source to drain voltage i t n e r r u c n i a r d e s r e v e r r d ) a ( pulse test 5 v 2 6 8 4.5 v
HAT2203C rev.4.00 may.19, 2005 page 5 of 6 vin monitor d.u.t. vin 4.5 v r l v ds = 10 v tr td(on) vin 90% 90% 10% 10% vout td(off) vout monitor 90% 10% t f switching time test circuit switching time waveform 4.7 ?
HAT2203C rev.4.00 may.19, 2005 page 6 of 6 package dimensions d a aa a a a 2 a 1 l l p s s s y b b 2 l 1 m x eh e e e e 1 c pattern of terminal position areas a a 1 a 2 b b 1 c c 1 d e e h e l l p x y b 2 e 1 l 1 0.6 0 0.7 0.15 0.1 1.9 1.6 2.05 0.1 0.15 0.22 0.2 0.13 0.11 2.0 1.7 0.65 2.1 0.2 1.65 0.8 0.01 0.79 0.3 0.15 2.1 1.8 2.15 0.3 0.45 0.05 0.05 0.35 0.5 dimension in millimeters reference symbol min nom max ? 0.0065g mass[typ.] cmfpak-6 / cmfpak-6v pwsf0006ja-a renesas code jeita package code package name b a-a section b 1 c 1 c ordering information part name quantity shipping container HAT2203C-el-e 3000 pcs taping note: for some grades, production may be terminated. please contact the renesas sales office to check the state of production before ordering the product.
keep safety first in your circuit designs! 1. renesas technology corp. puts the maximum effort into making semiconductor products better and more reliable, but there is al ways the possibility that trouble may occur with them. trouble with semiconductors may lead to personal injury, fire or property damage. remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. notes regarding these materials 1. these materials are intended as a reference to assist our customers in the selection of the renesas technology corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to renesas t echnology corp. or a third party. 2. renesas technology corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating i n the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. all information contained in these materials, including product data, diagrams, charts, programs and algorithms represents in formation on products at the time of publication of these materials, and are subject to change by renesas technology corp. without notice due to product improvement s or other reasons. it is therefore recommended that customers contact renesas technology corp. or an authorized renesas technology corp. product distrib utor for the latest product information before purchasing a product listed herein. the information described here may contain technical inaccuracies or typographical errors. renesas technology corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or e rrors. please also pay attention to information published by renesas technology corp. by various means, including the renesas technolo gy corp. semiconductor home page (http://www.renesas.com). 4. when using any or all of the information contained in these materials, including product data, diagrams, charts, programs, an d algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. renesas technology corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. renesas technology corp. semiconductors are not designed or manufactured for use in a device or system that is used under cir cumstances in which human life is potentially at stake. please contact renesas technology corp. or an authorized renesas technology corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerosp ace, nuclear, or undersea repeater use. 6. the prior written approval of renesas technology corp. is necessary to reprint or reproduce in whole or in part these materia ls. 7. if these products or technologies are subject to the japanese export control restrictions, they must be exported under a lice nse from the japanese government and cannot be imported into a country other than the approved destination. any diversion or reexport contrary to the export control laws and regulations of japan and/or the country of destination is pro hibited. 8. please contact renesas technology corp. for further details on these materials or the products contained therein. sales strategic planning div. nippon bldg., 2-6-2, ohte-machi, chiyoda-ku, tokyo 100-0004, japan http://www.renesas.com refer to " http://www.renesas.com/en/network " for the latest and detailed information. renesas technology america, inc. 450 holger way, san jose, ca 95134-1368, u.s.a tel: <1> (408) 382-7500, fax: <1> (408) 382-7501 renesas technology europe limited dukes meadow, millboard road, bourne end, buckinghamshire, sl8 5fh, u.k. tel: <44> (1628) 585-100, fax: <44> (1628) 585-900 renesas technology hong kong ltd. 7th floor, north tower, world finance centre, harbour city, 1 canton road, tsimshatsui, kowloon, hong kong tel: <852> 2265-6688, fax: <852> 2730-6071 renesas technology taiwan co., ltd. 10th floor, no.99, fushing north road, taipei, taiwan tel: <886> (2) 2715-2888, fax: <886> (2) 2713-2999 renesas technology (shanghai) co., ltd. unit2607 ruijing building, no.205 maoming road (s), shanghai 200020, china tel: <86> (21) 6472-1001, fax: <86> (21) 6415-2952 renesas technology singapore pte. ltd. 1 harbour front avenue, #06-10, keppel bay tower, singapore 098632 tel: <65> 6213-0200, fax: <65> 6278-8001 renesas sales offices ? 200 4. re nesas technology corp ., all rights reser v ed. printed in ja pan. colophon .2.0


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